5962-8852502YX vs 5962-8852510YC feature comparison

5962-8852502YX Xicor Inc

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5962-8852510YC Atmel Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XICOR INC ATMEL CORP
Package Description CERAMIC, LCC-32 QCCN,
Reach Compliance Code unknown unknown
Access Time-Max 300 ns 300 ns
JESD-30 Code R-CQCC-N32 R-CQCC-N32
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Current-Max 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD NO LEAD
Terminal Position QUAD QUAD
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 4 2
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Additional Feature AUTOMATIC WRITE
JESD-609 Code e4
Length 13.97 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 2.54 mm
Terminal Finish GOLD
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.43 mm

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Compare 5962-8852510YC with alternatives