5962-8852510YC vs X28C256EMT1 feature comparison

5962-8852510YC Atmel Corporation

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X28C256EMT1 Xicor Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ATMEL CORP XICOR INC
Package Description QCCN, CERAMIC, LCC-32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 300 ns 300 ns
Additional Feature AUTOMATIC WRITE PAGE WRITE
JESD-30 Code R-CQCC-N32 R-CQCC-N32
JESD-609 Code e4
Length 13.97 mm 13.97 mm
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 3.05 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish GOLD
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.43 mm 11.43 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 2 1
Output Characteristics 3-STATE

Compare 5962-8852510YC with alternatives

Compare X28C256EMT1 with alternatives