5962-8851804LX
vs
AM27S25A/BLA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
15 ns
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Memory Density
4096 bit
4096 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512X8
512X8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
COMMERCIAL
Supply Current-Max
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
3
Pbfree Code
Rohs Code
JESD-609 Code
e0
Length
31.9405 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
5.08 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
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