5962-88518043A
vs
AM27S25APCB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Part Package Code
QLCC
DIP
Package Description
QCCN,
DIP, DIP24,.3
Pin Count
28
24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
15 ns
150 ns
JESD-30 Code
S-CQCC-N28
R-PDIP-T24
JESD-609 Code
e0
e0
Length
11.43 mm
31.242 mm
Memory Density
4096 bit
262144 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
24
Number of Words
512 words
512 words
Number of Words Code
512
32000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
Organization
512X8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
QCCN
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.9812 mm
5.715 mm
Supply Current-Max
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
BIPOLAR
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
11.43 mm
7.62 mm
Base Number Matches
1
1
Rohs Code
Package Equivalence Code
DIP24,.3
Compare 5962-88518043A with alternatives
Compare AM27S25APCB with alternatives