5962-87793012X
vs
10631/BEAJC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
SRI INTERNATIONAL
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
QCCN,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
10K
JESD-30 Code
S-CQCC-N20
R-XDIP-T16
Length
8.885 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
6
Number of Functions
1
2
Number of Terminals
20
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
OPEN-EMITTER
Output Polarity
TRUE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
QCCN
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Propagation Delay (tpd)
5.3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.9 mm
Surface Mount
YES
NO
Technology
ECL
ECL10K
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Trigger Type
POSITIVE EDGE
MASTER-SLAVE
Width
8.885 mm
fmax-Min
125 MHz
Base Number Matches
3
3
Rohs Code
JESD-609 Code
e0
Max Frequency@Nom-Sup
200000000 Hz
Package Equivalence Code
DIP16,.3
Power Supplies
-5.2 V
Power Supply Current-Max (ICC)
72 mA
Screening Level
38535Q/M;38534H;883B
Terminal Finish
Tin/Lead (Sn/Pb)
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