5962-87792012A
vs
10174F
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Package Description |
QCCN, LCC20,.35SQ
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
10K
|
10K
|
| JESD-30 Code |
S-CQCC-N20
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8.885 mm
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
4
|
2
|
| Number of Inputs |
2
|
4
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-30 °C
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCN
|
DIP
|
| Package Equivalence Code |
LCC20,.35SQ
|
DIP16,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
53 mA
|
73 mA
|
| Prop. Delay@Nom-Sup |
3.5 ns
|
6.4 ns
|
| Propagation Delay (tpd) |
5 ns
|
6.4 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
1.9 mm
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
MILITARY
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.885 mm
|
|
| Base Number Matches |
5
|
4
|
| Pbfree Code |
|
No
|
| Supply Voltage-Nom (Vsup) |
|
-5.2 V
|
|
|
|
Compare 5962-87792012A with alternatives
Compare 10174F with alternatives