5962-8753101YX
vs
7201LA30LBG8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code
unknown
compliant
Access Time-Max
30 ns
30 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
40 ns
40 ns
JESD-609 Code
e4
e3
Length
13.97 mm
13.97 mm
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
BI-DIRECTIONAL FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512X9
512X9
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
3.048 mm
Supply Current-Max
0.1 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
GOLD
MATTE TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
11.43 mm
Base Number Matches
3
1
Pbfree Code
Rohs Code
Part Package Code
QFJ
Package Description
QCCN,
Pin Count
32
ECCN Code
EAR99
HTS Code
8542.32.00.71
JESD-30 Code
R-CQCC-N32
Number of Terminals
32
Package Shape
RECTANGULAR
Screening Level
MIL-STD-883 Class B
Compare 5962-8753101YX with alternatives
Compare 7201LA30LBG8 with alternatives