5962-8753101YX
vs
5962-8986305ZC
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
TEMIC SEMICONDUCTORS
|
Part Package Code |
QFJ
|
|
Package Description |
QCCN,
|
CERAMIC, LLCC-32
|
Pin Count |
32
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.71
|
|
Access Time-Max |
30 ns
|
30 ns
|
Additional Feature |
RETRANSMIT
|
RETRANSMIT
|
Cycle Time |
40 ns
|
40 ns
|
JESD-30 Code |
R-CQCC-N32
|
R-CQCC-N32
|
Length |
13.97 mm
|
13.97 mm
|
Memory Density |
4608 bit
|
4608 bit
|
Memory Width |
9
|
9
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
512 words
|
512 words
|
Number of Words Code |
512
|
512
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
512X9
|
512X9
|
Output Enable |
NO
|
NO
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCN
|
QCCN
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.048 mm
|
2.286 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
11.43 mm
|
11.43 mm
|
Base Number Matches |
3
|
2
|
JESD-609 Code |
|
e0
|
Memory IC Type |
|
OTHER FIFO
|
Supply Current-Max |
|
0.14 mA
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 5962-8753101YX with alternatives
Compare 5962-8986305ZC with alternatives