5962-8753101YX
vs
5962-8986305ZC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEMIC SEMICONDUCTORS
Part Package Code
QFJ
Package Description
QCCN,
CERAMIC, LLCC-32
Pin Count
32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
30 ns
30 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
40 ns
40 ns
JESD-30 Code
R-CQCC-N32
R-CQCC-N32
Length
13.97 mm
13.97 mm
Memory Density
4608 bit
4608 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512X9
512X9
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
2.286 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
11.43 mm
11.43 mm
Base Number Matches
3
2
JESD-609 Code
e0
Memory IC Type
OTHER FIFO
Supply Current-Max
0.14 mA
Terminal Finish
TIN LEAD
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Compare 5962-8986305ZC with alternatives