5962-8753101YX vs 5962-8986305ZC feature comparison

5962-8753101YX Integrated Device Technology Inc

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5962-8986305ZC Temic Semiconductors

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC TEMIC SEMICONDUCTORS
Part Package Code QFJ
Package Description QCCN, CERAMIC, LLCC-32
Pin Count 32
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 30 ns 30 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 40 ns 40 ns
JESD-30 Code R-CQCC-N32 R-CQCC-N32
Length 13.97 mm 13.97 mm
Memory Density 4608 bit 4608 bit
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512X9 512X9
Output Enable NO NO
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.048 mm 2.286 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.43 mm 11.43 mm
Base Number Matches 3 2
JESD-609 Code e0
Memory IC Type OTHER FIFO
Supply Current-Max 0.14 mA
Terminal Finish TIN LEAD

Compare 5962-8753101YX with alternatives

Compare 5962-8986305ZC with alternatives