5962-8751508KA
vs
CY7C263-25TMB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
QP SEMICONDUCTOR INC
CYPRESS SEMICONDUCTOR CORP
Package Description
WDFP,
WINDOWED, CERPACK-24
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
35 ns
25 ns
JESD-30 Code
R-GDFP-F24
R-GDFP-F24
JESD-609 Code
e0
e0
Length
15.367 mm
15.367 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDFP
WDFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, WINDOW
FLATPACK, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
2.54 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
9.652 mm
9.652 mm
Base Number Matches
1
1
Rohs Code
Part Package Code
DFP
Pin Count
24
Additional Feature
POWER SWITCHED PROM
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
FL24,.4
Screening Level
MIL-STD-883
Standby Current-Max
0.05 A
Supply Current-Max
0.14 mA
Compare 5962-8751508KA with alternatives
Compare CY7C263-25TMB with alternatives