5962-8687521UA
vs
IDT7130SA35PF9
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
DEFENSE LOGISTICS AGENCY
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Package Description |
CERAMIC, QFP-48
|
TQFP-64
|
Reach Compliance Code |
unknown
|
compliant
|
Access Time-Max |
35 ns
|
35 ns
|
Additional Feature |
INTERRUPT FLAG; AUTOMATIC POWER-DOWN
|
|
JESD-609 Code |
e0
|
e0
|
Length |
19.05 mm
|
14 mm
|
Memory Density |
8192 bit
|
8192 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Words |
1024 words
|
1024 words
|
Number of Words Code |
1000
|
1000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
1KX8
|
1KX8
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
QFF
|
LQFP
|
Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Qualified
|
Not Qualified
|
Seated Height-Max |
2.7432 mm
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
19.05 mm
|
14 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
QFP
|
Pin Count |
|
64
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.41
|
JESD-30 Code |
|
S-PQFP-G64
|
Moisture Sensitivity Level |
|
3
|
Number of Terminals |
|
64
|
Package Shape |
|
SQUARE
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 5962-8687521UA with alternatives
Compare IDT7130SA35PF9 with alternatives