5962-8687521UA vs IDT7130SA35PF9 feature comparison

5962-8687521UA Defense Logistics Agency

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IDT7130SA35PF9 Integrated Device Technology Inc

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer DEFENSE LOGISTICS AGENCY INTEGRATED DEVICE TECHNOLOGY INC
Package Description CERAMIC, QFP-48 TQFP-64
Reach Compliance Code unknown compliant
Access Time-Max 35 ns 35 ns
Additional Feature INTERRUPT FLAG; AUTOMATIC POWER-DOWN
JESD-609 Code e0 e0
Length 19.05 mm 14 mm
Memory Density 8192 bit 8192 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 1KX8 1KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QFF LQFP
Package Style FLATPACK FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Qualified Not Qualified
Seated Height-Max 2.7432 mm 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form FLAT GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position QUAD QUAD
Width 19.05 mm 14 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code QFP
Pin Count 64
ECCN Code EAR99
HTS Code 8542.32.00.41
JESD-30 Code S-PQFP-G64
Moisture Sensitivity Level 3
Number of Terminals 64
Package Shape SQUARE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare IDT7130SA35PF9 with alternatives