5962-8687511UX
vs
5962-8687515XX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
TEMIC SEMICONDUCTORS
Part Package Code
QFP
Package Description
QFF,
CERAMIC, DIP-48
Pin Count
48
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
55 ns
55 ns
JESD-30 Code
S-XQFP-F48
R-GDIP-T48
Memory Density
8192 bit
8192 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
1KX8
1KX8
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
QFF
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Seated Height-Max
2.74 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Base Number Matches
1
1
I/O Type
COMMON
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
DIP48,.6
Standby Current-Max
0.004 A
Standby Voltage-Min
2 V
Supply Current-Max
0.185 mA
Compare 5962-8687511UX with alternatives
Compare 5962-8687515XX with alternatives