5962-8687508XA
vs
5962-8687507XA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
DEFENSE LOGISTICS AGENCY
|
| Package Description |
DIP-48
|
0.600 INCH, SIDE BRAZED, DIP-48
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
45 ns
|
55 ns
|
| Additional Feature |
INTERRUPT FLAG; AUTOMATIC POWER-DOWN
|
INTERRUPT FLAG; AUTOMATIC POWER-DOWN
|
| JESD-30 Code |
R-CDIP-T48
|
|
| JESD-609 Code |
e0
|
e0
|
| Length |
60.96 mm
|
60.96 mm
|
| Memory Density |
8192 bit
|
8192 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
|
| Number of Words |
1024 words
|
1024 words
|
| Number of Words Code |
1000
|
1000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
1KX8
|
1KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Seated Height-Max |
4.826 mm
|
4.826 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
15.24 mm
|
15.24 mm
|
| Base Number Matches |
6
|
6
|
|
|
|
Compare 5962-8687508XA with alternatives
Compare 5962-8687507XA with alternatives