5962-8685913UC
vs
5962-8685913XA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
AUSTIN SEMICONDUCTOR INC
|
STMICROELECTRONICS
|
| Package Description |
,
|
QCCN,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| JESD-609 Code |
e4
|
e0
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Terminal Finish |
GOLD
|
TIN LEAD
|
| Base Number Matches |
1
|
3
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
28
|
| Access Time-Max |
|
55 ns
|
| JESD-30 Code |
|
R-CQCC-N28
|
| Length |
|
13.97 mm
|
| Memory Density |
|
65536 bit
|
| Memory IC Type |
|
STANDARD SRAM
|
| Memory Width |
|
4
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
| Number of Terminals |
|
28
|
| Number of Words |
|
16384 words
|
| Number of Words Code |
|
16000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
|
16KX4
|
| Output Characteristics |
|
3-STATE
|
| Output Enable |
|
YES
|
| Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
|
QCCN
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
CHIP CARRIER
|
| Parallel/Serial |
|
PARALLEL
|
| Seated Height-Max |
|
1.981 mm
|
| Standby Voltage-Min |
|
2 V
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
MILITARY
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
8.89 mm
|
|
|
|
Compare 5962-8685913UC with alternatives
Compare 5962-8685913XA with alternatives