5962-3829414MMX vs 5962-3829407MYX feature comparison

5962-3829414MMX Intel Corporation

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5962-3829407MYX Electronic Designs Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP ELECTRONIC DESIGNS INC
Package Description DFP, CERAMIC, LCC-32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 25 ns 70 ns
JESD-30 Code R-CDFP-F28 R-CQCC-N32
Length 18.285 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DFP QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 MIL-PRF-38535
Seated Height-Max 2.97 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form FLAT NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL QUAD
Width 10.415 mm
Base Number Matches 1 1

Compare 5962-3829414MMX with alternatives

Compare 5962-3829407MYX with alternatives