5962-3829410MXX
vs
IDT71256SA25PZI8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
DIP
TSOP
Package Description
CERAMIC, DIP-28
TSOP1-28
Pin Count
28
28
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
25 ns
JESD-30 Code
R-GDIP-T28
R-PDSO-G28
Memory Density
65536 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
32768 words
Number of Words Code
8000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
8KX8
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Rohs Code
JESD-609 Code
e0
Length
11.8 mm
Moisture Sensitivity Level
3
Seated Height-Max
1.2 mm
Terminal Finish
TIN LEAD
Terminal Pitch
0.55 mm
Width
8 mm
Compare 5962-3829410MXX with alternatives
Compare IDT71256SA25PZI8 with alternatives