5962-3829406MYA vs P4C164-70DWC feature comparison

5962-3829406MYA Integrated Device Technology Inc

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P4C164-70DWC Pyramid Semiconductor Corporation

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC PYRAMID SEMICONDUCTOR CORP
Part Package Code QFJ DIP
Package Description QCCN, LCC32,.45X.55 DIP,
Pin Count 32 28
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type COMMON
JESD-30 Code R-CQCC-N32 R-CDIP-T28
JESD-609 Code e0
Length 13.97 mm 37.846 mm
Memory Density 65536 bit 65536 bit
Memory IC Type OTHER SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN DIP
Package Equivalence Code LCC32,.45X.55
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 3.048 mm 5.08 mm
Standby Current-Max 0.0003 A
Standby Voltage-Min 2 V
Supply Current-Max 0.09 mA 0.13 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.43 mm 15.24 mm
Base Number Matches 1 2
Rohs Code No
Additional Feature LG-MAX
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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