5962-3829406MYA
vs
P4C164-70CWMB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
AUSTIN SEMICONDUCTOR INC
PYRAMID SEMICONDUCTOR CORP
Package Description
QCCN, LCC32,.45X.55
DIP,
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
I/O Type
COMMON
JESD-30 Code
R-CQCC-N32
R-CDIP-T28
JESD-609 Code
e0
Length
13.97 mm
37.846 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
DIP
Package Equivalence Code
LCC32,.45X.55
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
MIL-STD-883 Class B
Seated Height-Max
3.048 mm
5.08 mm
Standby Current-Max
0.0003 A
Standby Voltage-Min
2 V
Supply Current-Max
0.09 mA
0.145 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
11.43 mm
15.24 mm
Base Number Matches
3
1
Rohs Code
Part Package Code
DIP
Pin Count
28
Additional Feature
LG-MAX
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 5962-3829406MYA with alternatives
Compare P4C164-70CWMB with alternatives