5962-3826705MUA
vs
5962-3826718QNX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
XICOR INC
MICROSS COMPONENTS
Package Description
CERAMIC, LCC-32
CERAMIC, FP-32
Reach Compliance Code
unknown
compliant
Access Time-Max
150 ns
150 ns
JESD-30 Code
R-CQCC-N32
R-CDFP-F32
JESD-609 Code
e0
Length
13.965 mm
20.828 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-PRF-38535 Class Q
Seated Height-Max
3.05 mm
3.81 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
DUAL
Width
11.425 mm
11.05 mm
Base Number Matches
1
1
Part Package Code
DFP
Pin Count
32
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Write Cycle Time-Max (tWC)
10 ms
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Compare 5962-3826718QNX with alternatives