5962-3826701MXB
vs
5962-3826716QMC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
MAXIM INTEGRATED PRODUCTS INC
Package Description
DIP,
CERAMIC, DFP-32
Reach Compliance Code
unknown
unknown
Access Time-Max
250 ns
250 ns
Additional Feature
AUTOMATIC WRITE; DATA RETENTION: 10 YEARS
Data Retention Time-Min
10
JESD-30 Code
R-GDIP-T32
R-CDFP-F32
JESD-609 Code
e0
e4
Length
42.2 mm
20.825 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX8
128KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-PRF-38535 Class Q
Seated Height-Max
5.72 mm
3.12 mm
Supply Current-Max
0.08 mA
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
GOLD
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
11.05 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
1
1
Part Package Code
DFP
Pin Count
32
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Compare 5962-3826701MXB with alternatives
Compare 5962-3826716QMC with alternatives