5962-3826701MXB vs 5962-3826701MXX feature comparison

5962-3826701MXB Xicor Inc

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5962-3826701MXX LSI Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XICOR INC SEEQ TECHNOLOGY INC
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
Access Time-Max 250 ns 250 ns
Additional Feature AUTOMATIC WRITE; DATA RETENTION: 10 YEARS AUTOMATIC WRITE; DATA RETENTION: 10 YEARS
Data Retention Time-Min 10 10
JESD-30 Code R-GDIP-T32 R-GDIP-T32
JESD-609 Code e0
Length 42.2 mm 42.2 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 128KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.72 mm 5.72 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 15.24 mm 15.24 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 6
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51

Compare 5962-3826701MXB with alternatives

Compare 5962-3826701MXX with alternatives