5962-3805504BEB vs 5962R9663702VEC feature comparison

5962-3805504BEB Texas Instruments

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5962R9663702VEC Harris Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC HARRIS SEMICONDUCTOR
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-CDIP-T16
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 345 ns 189 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 12.5 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
JESD-609 Code e4
Terminal Finish GOLD
Total Dose 100k Rad(Si) V

Compare 5962-3805504BEB with alternatives

Compare 5962R9663702VEC with alternatives