5962-01-390-1487
vs
MCP6142-E/P
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Contact Manufacturer
|
Active
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Moisture Sensitivity Level |
1
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
DIP
|
Package Description |
|
DIP, DIP8,.3
|
Pin Count |
|
8
|
Factory Lead Time |
|
6 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
Architecture |
|
VOLTAGE-FEEDBACK
|
Average Bias Current-Max (IIB) |
|
0.005 µA
|
Common-mode Reject Ratio-Min |
|
62 dB
|
Common-mode Reject Ratio-Nom |
|
80 dB
|
Frequency Compensation |
|
YES
|
Input Offset Voltage-Max |
|
3000 µV
|
JESD-30 Code |
|
R-PDIP-T8
|
JESD-609 Code |
|
e3
|
Length |
|
9.271 mm
|
Low-Bias |
|
YES
|
Low-Offset |
|
NO
|
Micropower |
|
YES
|
Number of Functions |
|
2
|
Number of Terminals |
|
8
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
DIP
|
Package Equivalence Code |
|
DIP8,.3
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Packing Method |
|
TUBE
|
Power |
|
NO
|
Programmable Power |
|
NO
|
Seated Height-Max |
|
5.334 mm
|
Slew Rate-Nom |
|
24000 V/us
|
Supply Current-Max |
|
0.002 mA
|
Supply Voltage Limit-Max |
|
7 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Finish |
|
MATTE TIN
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Unity Gain BW-Nom |
|
100
|
Voltage Gain-Min |
|
56200
|
Wideband |
|
NO
|
Width |
|
7.62 mm
|
|
|
|
Compare 5962-01-390-1487 with alternatives
Compare MCP6142-E/P with alternatives