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5962-01-130-3405 vs MBM2147EC feature comparison

5962-01-130-3405 AMD

Buy Now Datasheet

MBM2147EC FUJITSU Limited

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC FUJITSU LTD
Package Description DIP, DIP18,.3 DIP, DIP18,.3
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type SEPARATE SEPARATE
JESD-30 Code R-XDIP-T18 R-XDIP-T18
Memory Density 4096 bit 4096 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Terminals 18 18
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX1 4KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP18,.3 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 0.16 mA 0.16 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology MOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 2
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)
Memory » SRAMs
Memory » SRAMs

Compare 5962-01-130-3405 with alternatives

Compare MBM2147EC with alternatives