54QHST253FL
vs
SN74LS157ND
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GEC PLESSEY SEMICONDUCTORS
MOTOROLA INC
Package Description
,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
Family
HST/T
LS
JESD-30 Code
R-CDFP-F16
R-PDIP-T16
Load Capacitance (CL)
50 pF
15 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
2
4
Number of Inputs
4
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DFP
DIP
Package Equivalence Code
FL16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Propagation Delay (tpd)
25 ns
27 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
FLAT
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
3
Rohs Code
Part Package Code
DIP
Pin Count
16
HTS Code
8542.39.00.01
JESD-609 Code
e0
Length
19.175 mm
Max I(ol)
0.008 A
Power Supply Current-Max (ICC)
16 mA
Prop. Delay@Nom-Sup
27 ns
Seated Height-Max
4.44 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 54QHST253FL with alternatives
Compare SN74LS157ND with alternatives