54LS257A/BEAJC
vs
74HC257DB
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
NEXPERIA
|
Package Description |
DIP, DIP16,.3
|
SSOP,
|
Reach Compliance Code |
unknown
|
compliant
|
Family |
LS
|
HC/UH
|
JESD-30 Code |
R-XDIP-T16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
e4
|
Length |
19.3 mm
|
6.2 mm
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.012 A
|
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SSOP
|
Package Equivalence Code |
DIP16,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Power Supplies |
5 V
|
|
Power Supply Current-Max (ICC) |
19 mA
|
|
Prop. Delay@Nom-Sup |
21 ns
|
|
Propagation Delay (tpd) |
39 ns
|
165 ns
|
Qualification Status |
Not Qualified
|
|
Screening Level |
38535Q/M;38534H;883B
|
|
Seated Height-Max |
4.19 mm
|
2 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
TTL
|
CMOS
|
Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
7.62 mm
|
5.3 mm
|
Base Number Matches |
3
|
3
|
HTS Code |
|
8542.39.00.01
|
Date Of Intro |
|
2017-02-01
|
Moisture Sensitivity Level |
|
1
|
|
|
|
Compare 54LS257A/BEAJC with alternatives
Compare 74HC257DB with alternatives