54HHSC157CB vs 54QHSC157CS feature comparison

54HHSC157CB Dynex Semiconductor

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54QHSC157CS Dynex Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GEC PLESSEY SEMICONDUCTORS GEC PLESSEY SEMICONDUCTORS
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HSC HSC
JESD-30 Code R-CDIP-T16 R-CDIP-T16
JESD-609 Code e0 e0
Length 20.58 mm 20.58 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.009 A 0.009 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 25 ns 25 ns
Propagation Delay (tpd) 25 ns 25 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B 38535V;38534K;883S
Seated Height-Max 5.6 mm 5.6 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 1M Rad(Si) V 300k Rad(Si) V
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
kg CO2e/kg 12.6
Average Weight (mg) 1187.4
CO2e (mg) 14961.241
Category CO2 Kg 12.6
Compliance Temperature Grade Military: -55C to +125C
Qualifications Rad Hard

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