54F776/BYA
vs
N74F776A
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS COMPONENTS
|
| Part Package Code |
DFP
|
|
| Package Description |
DFP,
|
,
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
COMPATIBLE PI-BUS & IEEE 896 FUTUREBUS STANDARDS; BTL PORT OPEN COLLECTOR OUTPUTS
|
WITH DESIGNATED TTL AND BTL PORTS; COMPATIBLE WITH PI-BUS & IEEE 896 FUTUREBUS STANDARDS
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-CDFP-F28
|
S-PQCC-J28
|
| Load Capacitance (CL) |
30 pF
|
50 pF
|
| Logic IC Type |
REGISTERED BUS TRANSCEIVER
|
REGISTERED BUS TRANSCEIVER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Characteristics |
OPEN-COLLECTOR/3-STATE
|
OPEN-COLLECTOR/3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DFP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Power Supply Current-Max (ICC) |
145 mA
|
145 mA
|
| Propagation Delay (tpd) |
9.5 ns
|
11 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.286 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Form |
FLAT
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
9.144 mm
|
|
| Base Number Matches |
3
|
3
|
|
|
|
Compare 54F776/BYA with alternatives
Compare N74F776A with alternatives