54F51/B2A
vs
M54HC51F1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
STMICROELECTRONICS
Package Description
QCCN,
FRIT SEALED, CERAMIC, DIP-14
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ASYMMETRICAL I/P'S
ASYMMETRICAL INPUTS
Family
F/FAST
HC/UH
JESD-30 Code
S-CQCC-N20
R-GDIP-T14
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND-OR-INVERT GATE
AND-OR-INVERT GATE
Number of Functions
2
2
Number of Inputs
6
6
Number of Terminals
20
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
QCCN
DIP
Package Equivalence Code
LCC20,.35SQ
DIP14,.3
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Power Supply Current-Max (ICC)
7.5 mA
Propagation Delay (tpd)
5 ns
33 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
TTL
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
QUAD
DUAL
Base Number Matches
3
2
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
14
JESD-609 Code
e0
Max I(ol)
0.004 A
Prop. Delay@Nom-Sup
33 ns
Schmitt Trigger
NO
Seated Height-Max
5 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 54F51/B2A with alternatives
Compare M54HC51F1 with alternatives