54F164AFMQB
vs
54F164/BDA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
PHILIPS COMPONENTS
|
| Package Description |
DFP, FL14,.3
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Count Direction |
RIGHT
|
RIGHT
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-GDFP-F14
|
R-CDFP-F14
|
| JESD-609 Code |
e0
|
|
| Length |
9.614 mm
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
SERIAL IN PARALLEL OUT
|
SERIAL IN PARALLEL OUT
|
| Max Frequency@Nom-Sup |
60000000 Hz
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Power Supply Current-Max (ICC) |
55 mA
|
50 mA
|
| Propagation Delay (tpd) |
9 ns
|
13 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
2.03 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
6.3 mm
|
|
| fmax-Min |
80 MHz
|
90 MHz
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare 54F164AFMQB with alternatives
Compare 54F164/BDA with alternatives