54ACTQ827FMQB
vs
54ACTQ827FMX
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DFP-24
|
DFP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Control Type |
ENABLE LOW
|
|
| Count Direction |
UNIDIRECTIONAL
|
|
| Family |
ACT
|
ACT
|
| JESD-30 Code |
R-CDFP-F24
|
R-CDFP-F24
|
| Length |
15.43 mm
|
15.4305 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max I(ol) |
0.024 A
|
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL24,.4
|
FL24,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Power Supply Current-Max (ICC) |
50 mA
|
|
| Prop. Delay@Nom-Sup |
9 ns
|
|
| Propagation Delay (tpd) |
9 ns
|
9 ns
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Seated Height-Max |
2.286 mm
|
2.286 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.668 mm
|
|
| Base Number Matches |
5
|
1
|
| Additional Feature |
|
WITH DUAL OUTPUT ENABLE
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
MILITARY
|
|
|
|
Compare 54ACTQ827FMQB with alternatives
Compare 54ACTQ827FMX with alternatives