54ABT373E-QML
vs
HD74BC373AT
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
RENESAS ELECTRONICS CORP
|
| Package Description |
QCCN, LCC20,.35SQ
|
TSSOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
ABT
|
BCT/FBT
|
| JESD-30 Code |
S-CQCC-N20
|
R-PDSO-G20
|
| JESD-609 Code |
e0
|
|
| Length |
8.89 mm
|
6.5 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max I(ol) |
0.048 A
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
TSSOP
|
| Package Equivalence Code |
LCC20,.35SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Prop. Delay@Nom-Sup |
7 ns
|
|
| Propagation Delay (tpd) |
7.7 ns
|
10 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535
|
|
| Seated Height-Max |
1.905 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.89 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
20
|
|
|
|
Compare 54ABT373E-QML with alternatives
Compare HD74BC373AT with alternatives