5018/BWA
vs
SE5018N
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
0.400 INCH, PLASTIC, DIP-22
|
| Pin Count |
22
|
22
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Output Voltage-Max |
5.5 V
|
5.25 V
|
| Analog Output Voltage-Min |
-5.25 V
|
-5.25 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| JESD-30 Code |
R-CDIP-T22
|
R-PDIP-T22
|
| Linearity Error-Max (EL) |
0.19%
|
0.19%
|
| Negative Supply Voltage-Nom |
-15 V
|
-15 V
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
22
|
22
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Settling Time-Nom (tstl) |
1.8 µs
|
2.3 µs
|
| Supply Current-Max |
15 mA
|
15 mA
|
| Supply Voltage-Nom |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Length |
|
28 mm
|
| Package Equivalence Code |
|
DIP22,.4
|
| Seated Height-Max |
|
4.83 mm
|
| Technology |
|
BIPOLAR
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
10.16 mm
|
|
|
|
Compare 5018/BWA with alternatives
Compare SE5018N with alternatives