5018/BWA
vs
NE5018N
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
Package Description |
DIP, DIP22,.4
|
DIP, DIP22,.4
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
JESD-30 Code |
R-XDIP-T22
|
R-PDIP-T22
|
JESD-609 Code |
e0
|
e0
|
Linearity Error-Max (EL) |
0.19%
|
0.19%
|
Negative Supply Voltage-Nom |
-15 V
|
-15 V
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
22
|
22
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP22,.4
|
DIP22,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Supply Current-Max |
15 mA
|
15 mA
|
Supply Voltage-Nom |
15 V
|
15 V
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
3
|
|
|
|