47L04T-I/ST
vs
MRF24WN0MB-I/RM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
TSSOP-8
ROHS COMPLIANT, MODULE-37
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
8542.39.00.01
Factory Lead Time
9 Weeks
Date Of Intro
2016-10-10
Samacsys Manufacturer
Microchip
Access Time-Max
400 ns
JESD-30 Code
R-PDSO-G8
R-XXMA-N37
JESD-609 Code
e3
Length
4.4 mm
26.67 mm
Memory Density
4096 bit
Memory IC Type
MEMORY CIRCUIT
Memory Width
8
Mixed Memory Type
EEPROM+SRAM
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
1
Number of Terminals
8
37
Number of Words
512 words
Number of Words Code
512
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512X8
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
XMA
Package Equivalence Code
TSSOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.2 mm
2.28 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
UNSPECIFIED
Time@Peak Reflow Temperature-Max (s)
40
Width
3 mm
17.78 mm
Base Number Matches
1
1
Supply Voltage-Nom
3.3 V
Telecom IC Type
TELECOM CIRCUIT
Compare 47L04T-I/ST with alternatives
Compare MRF24WN0MB-I/RM with alternatives