47L04-I/SN
vs
CY15B004J-SXA
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
INFINEON TECHNOLOGIES AG
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Factory Lead Time |
14 Weeks
|
2 Days
|
| Date Of Intro |
2016-10-10
|
|
| Samacsys Manufacturer |
Microchip
|
Infineon
|
| Access Time-Max |
400 ns
|
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.9 mm
|
4.889 mm
|
| Memory Density |
4096 bit
|
4096 bit
|
| Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
| Memory Width |
8
|
8
|
| Mixed Memory Type |
EEPROM+SRAM
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
8
|
8
|
| Number of Words |
512 words
|
512 words
|
| Number of Words Code |
512
|
512
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512X8
|
512X8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.23
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.75 mm
|
1.727 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.65 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
3.9 mm
|
3.8985 mm
|
| Base Number Matches |
1
|
2
|
| Package Description |
|
SOIC-8
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
|
|
|
Compare 47L04-I/SN with alternatives
Compare CY15B004J-SXA with alternatives