3D7503G-10
vs
MB502A
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
DATA DELAY DEVICES INC
FUJITSU LTD
Part Package Code
SOIC
DIP
Package Description
SOP,
CERDIP-24
Pin Count
14
24
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G14
R-GDIP-T24
Length
19.305 mm
31.78 mm
Number of Functions
1
1
Number of Terminals
14
24
Operating Temperature-Max
70 °C
100 °C
Operating Temperature-Min
-25 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
5.84 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
Telecom IC Type
MANCHESTER ENCODER/DECODER
MANCHESTER ENCODER/DECODER
Temperature Grade
COMMERCIAL
OTHER
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
6.35 mm
15.24 mm
Base Number Matches
1
2
Supply Current-Max
220 mA
Compare 3D7503G-10 with alternatives
Compare MB502A with alternatives