MB502A
vs
3D7503D-25
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
FUJITSU LTD
DATA DELAY DEVICES INC
Part Package Code
DIP
SOIC
Package Description
CERDIP-24
SOP,
Pin Count
24
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-GDIP-T24
R-PDSO-G14
Length
31.78 mm
8.695 mm
Number of Functions
1
1
Number of Terminals
24
14
Operating Temperature-Max
100 °C
70 °C
Operating Temperature-Min
-25 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.84 mm
1.75 mm
Supply Current-Max
220 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Telecom IC Type
MANCHESTER ENCODER/DECODER
MANCHESTER ENCODER/DECODER
Temperature Grade
OTHER
COMMERCIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
3.9 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Technology
CMOS
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MB502A with alternatives
Compare 3D7503D-25 with alternatives