3D7503-30 vs AM7991ADCB feature comparison

3D7503-30 Data Delay Devices Inc

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AM7991ADCB AMD

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer DATA DELAY DEVICES INC ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, HERMETIC SEALED, CERDIP-24
Pin Count 14 24
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-GDIP-T24
Length 19.305 mm 32.0675 mm
Number of Functions 1 1
Number of Terminals 14 24
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.58 mm 5.715 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS
Telecom IC Type MANCHESTER ENCODER/DECODER MANCHESTER ENCODER/DECODER
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 15.24 mm
Base Number Matches 1 1

Compare 3D7503-30 with alternatives

Compare AM7991ADCB with alternatives