AM7991ADCB
vs
3D7503G-40
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
DATA DELAY DEVICES INC
Part Package Code
DIP
SOIC
Package Description
HERMETIC SEALED, CERDIP-24
SOP,
Pin Count
24
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-GDIP-T24
R-PDSO-G14
Length
32.0675 mm
19.305 mm
Number of Functions
1
1
Number of Terminals
24
14
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.715 mm
4.57 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Telecom IC Type
MANCHESTER ENCODER/DECODER
MANCHESTER ENCODER/DECODER
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
15.24 mm
6.35 mm
Base Number Matches
1
1
Technology
CMOS
Compare AM7991ADCB with alternatives
Compare 3D7503G-40 with alternatives