3829412BMC
vs
5962-8552508TX
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROSS COMPONENTS
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
DFP
|
|
Package Description |
DFP,
|
,
|
Pin Count |
28
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
35 ns
|
|
JESD-30 Code |
R-CDFP-F28
|
|
Length |
18.285 mm
|
|
Memory Density |
65536 bit
|
|
Memory IC Type |
STANDARD SRAM
|
|
Memory Width |
8
|
|
Number of Functions |
1
|
|
Number of Terminals |
28
|
|
Number of Words |
8192 words
|
|
Number of Words Code |
8000
|
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
8KX8
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
|
Package Code |
DFP
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
FLATPACK
|
|
Parallel/Serial |
PARALLEL
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.97 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
MILITARY
|
|
Terminal Form |
FLAT
|
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
|
Width |
10.415 mm
|
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 3829412BMC with alternatives
Compare 5962-8552508TX with alternatives