3829410BMC
vs
5962-8552511YC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROSS COMPONENTS
ELECTRONIC DESIGNS INC
Part Package Code
DFP
Package Description
DFP,
Pin Count
28
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Category CO2 Kg
12
Compliance Temperature Grade
Military: -55C to +125C
Candidate List Date
2019-01-15
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.12
Access Time-Max
45 ns
70 ns
JESD-30 Code
R-CDFP-F28
Length
18.285 mm
13.97 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
QCCN
Package Shape
RECTANGULAR
Package Style
FLATPACK
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.97 mm
1.981 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
10.415 mm
11.43 mm
Base Number Matches
1
1
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare 3829410BMC with alternatives
Compare 5962-8552511YC with alternatives