32R2211X-2CL16R
vs
HA166024FP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SILICON SYSTEMS INC
HITACHI LTD
Package Description
,
SOP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Drive Type
WINCHESTER
Interface IC Type
READ WRITE AMPLIFIER CIRCUIT
READ WRITE AMPLIFIER CIRCUIT
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Number of Channels
2
2
Number of Functions
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
55 mA
110 mA
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
BICMOS
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Rohs Code
JESD-609 Code
e0
Length
10.06 mm
Package Equivalence Code
DIP16,.3
Seated Height-Max
2.2 mm
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
1.27 mm
Width
5.5 mm
Compare 32R2211X-2CL16R with alternatives
Compare HA166024FP with alternatives