30KPA258A
vs
30KPA258A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
SANGDEST MICROELECTRONICS (NANJING) CO LTD
MICROSEMI CORP
Package Description
O-PALF-W2
PLASTIC PACKAGE-2
Reach Compliance Code
compliant
unknown
Additional Feature
EXCELLENT CLAMPING CAPABILITY
Breakdown Voltage-Max
316.8 V
Breakdown Voltage-Min
286.8 V
288.2 V
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
TRANS VOLTAGE SUPPRESSOR DIODE
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code
O-PALF-W2
O-PALF-W2
Non-rep Peak Rev Power Dis-Max
30000 W
30000 W
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
8 W
1.61 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
UL RECOGNIZED
Rep Pk Reverse Voltage-Max
256 V
258 V
Surface Mount
NO
NO
Technology
AVALANCHE
AVALANCHE
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
2
13
Pbfree Code
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Clamping Voltage-Max
416.4 V
JESD-609 Code
e0
Moisture Sensitivity Level
1
Terminal Finish
TIN LEAD
Compare 30KPA258A with alternatives
Compare 30KPA258A with alternatives