30054-33
vs
30054-33
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
SPGA, SPGA320,37X37
|
SPGA, SPGA320,37X37
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
ALSO REQUIRES 3.3V SUPPLY
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CPGA-P320
|
S-CPGA-P320
|
| JESD-609 Code |
e0
|
e0
|
| Length |
49.595 mm
|
49.595 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
320
|
320
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SPGA
|
SPGA
|
| Package Equivalence Code |
SPGA320,37X37
|
SPGA320,37X37
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, SHRINK PITCH
|
GRID ARRAY, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.07 mm
|
3.07 mm
|
| Speed |
233 MHz
|
233 MHz
|
| Supply Current-Max |
2850 mA
|
2850 mA
|
| Supply Voltage-Max |
3.05 V
|
3.05 V
|
| Supply Voltage-Min |
2.75 V
|
2.75 V
|
| Supply Voltage-Nom |
2.9 V
|
2.9 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| Width |
49.595 mm
|
49.595 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 30054-33 with alternatives
Compare 30054-33 with alternatives