2SK1647(L)
vs
2SK1647(L)
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
HITACHI LTD
|
Part Package Code |
TO-252
|
TO-252
|
Package Description |
LDPAK-3
|
IN-LINE, R-PSIP-T3
|
Pin Count |
3
|
3
|
Reach Compliance Code |
unknown
|
unknown
|
Drain-source On Resistance-Max |
7 Ω
|
7 Ω
|
JESD-30 Code |
R-PSIP-T3
|
R-PSIP-T3
|
JESD-609 Code |
e0
|
|
Number of Terminals |
3
|
3
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
SINGLE
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
3
|
1
|
ECCN Code |
|
EAR99
|
Configuration |
|
SINGLE
|
Drain Current-Max (ID) |
|
2 A
|
FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
Number of Elements |
|
1
|
Operating Temperature-Max |
|
150 °C
|
Polarity/Channel Type |
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
|
50 W
|
|
|
|