2SB1375 vs BUX32 feature comparison

2SB1375 Toshiba America Electronic Components

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BUX32 TT Electronics Power and Hybrid / Semelab Limited

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP SEMELAB LTD
Part Package Code SC-67 TO-3
Package Description FLANGE MOUNT, R-PSFM-T3 FLANGE MOUNT, O-MBFM-P2
Pin Count 3 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95
Case Connection ISOLATED COLLECTOR
Collector Current-Max (IC) 3 A 8 A
Collector-Emitter Voltage-Max 60 V 400 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 15 8
JESD-30 Code R-PSFM-T3 O-MBFM-P2
Number of Elements 1 1
Number of Terminals 3 2
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY METAL
Package Shape RECTANGULAR ROUND
Package Style FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type PNP NPN
Power Dissipation Ambient-Max 25 W
Power Dissipation-Max (Abs) 2 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Position SINGLE BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Application AMPLIFIER
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 9 MHz 15 MHz
VCEsat-Max 1.5 V
Base Number Matches 2 5
JEDEC-95 Code TO-204AA

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