2N7224U
vs
IRFN150SMDR4
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROSEMI CORP
TT ELECTRONICS PLC
Part Package Code
TO-276AB
Package Description
SMD-1, U-PKG-3
CHIP CARRIER, R-CBCC-N3
Pin Count
3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Case Connection
DRAIN
DRAIN
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min
100 V
100 V
Drain Current-Max (ID)
34 A
27 A
Drain-source On Resistance-Max
0.081 Ω
0.081 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code
TO-276AB
JESD-30 Code
R-XBCC-N3
R-CBCC-N3
JESD-609 Code
e0
e4
Number of Elements
1
1
Number of Terminals
3
3
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN LEAD
GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Position
BOTTOM
BOTTOM
Transistor Element Material
SILICON
SILICON
Base Number Matches
5
1
Avalanche Energy Rating (Eas)
150 mJ
Operating Temperature-Max
150 °C
Pulsed Drain Current-Max (IDM)
108 A
Compare 2N7224U with alternatives
Compare IRFN150SMDR4 with alternatives