2N6083 vs MS1337 feature comparison

2N6083 Microsemi Corporation

Buy Now Datasheet

MS1337 Microchip Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description POST/STUD MOUNT, O-XRPM-F4 PLASTIC, M113, 4 PIN
Pin Count 4
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Additional Feature HIGH EFFICIENCY, WITH EMITTER BALLASTED RESISTORS WITH EMITTER BALLASTING RESISTORS
Collector Current-Max (IC) 4 A 8 A
Collector-Base Capacitance-Max 130 pF 120 pF
Collector-Emitter Voltage-Max 18 V 18 V
Configuration SINGLE WITH BUILT-IN RESISTOR SINGLE
DC Current Gain-Min (hFE) 5
Highest Frequency Band VERY HIGH FREQUENCY BAND VERY HIGH FREQUENCY BAND
JESD-30 Code O-XRPM-F4 O-PRFM-F4
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 4 4
Operating Temperature-Max 200 °C 200 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style POST/STUD MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 65 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish TIN LEAD TIN LEAD
Terminal Form FLAT FLAT
Terminal Position RADIAL RADIAL
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 200 MHz
Base Number Matches 1 1

Compare 2N6083 with alternatives

Compare MS1337 with alternatives