2N6083
vs
MS1337
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
POST/STUD MOUNT, O-XRPM-F4
PLASTIC, M113, 4 PIN
Pin Count
4
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Additional Feature
HIGH EFFICIENCY, WITH EMITTER BALLASTED RESISTORS
WITH EMITTER BALLASTING RESISTORS
Collector Current-Max (IC)
4 A
8 A
Collector-Base Capacitance-Max
130 pF
120 pF
Collector-Emitter Voltage-Max
18 V
18 V
Configuration
SINGLE WITH BUILT-IN RESISTOR
SINGLE
DC Current Gain-Min (hFE)
5
Highest Frequency Band
VERY HIGH FREQUENCY BAND
VERY HIGH FREQUENCY BAND
JESD-30 Code
O-XRPM-F4
O-PRFM-F4
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
4
4
Operating Temperature-Max
200 °C
200 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
POST/STUD MOUNT
FLANGE MOUNT
Polarity/Channel Type
NPN
NPN
Power Dissipation-Max (Abs)
65 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Position
RADIAL
RADIAL
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
200 MHz
Base Number Matches
1
1
Compare 2N6083 with alternatives
Compare MS1337 with alternatives