2N5639G
vs
BS170
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
TOPAZ SEMICONDUCTOR
|
| Part Package Code |
TO-92
|
|
| Package Description |
LEAD FREE, CASE 29-11, TO-92, 3 PIN
|
|
| Pin Count |
3
|
|
| Manufacturer Package Code |
CASE 29-11
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Configuration |
SINGLE
|
SINGLE
|
| DS Breakdown Voltage-Min |
30 V
|
|
| Drain-source On Resistance-Max |
60 Ω
|
|
| FET Technology |
JUNCTION
|
METAL-OXIDE SEMICONDUCTOR
|
| Feedback Cap-Max (Crss) |
4 pF
|
|
| JEDEC-95 Code |
TO-226AA
|
|
| JESD-30 Code |
O-PBCY-T3
|
|
| JESD-609 Code |
e1
|
e0
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
|
| Operating Mode |
DEPLETION MODE
|
ENHANCEMENT MODE
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Shape |
ROUND
|
|
| Package Style |
CYLINDRICAL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Qualification Status |
COMMERCIAL
|
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Transistor Application |
SWITCHING
|
|
| Transistor Element Material |
SILICON
|
|
| Base Number Matches |
2
|
29
|
| ECCN Code |
|
EAR99
|
| Drain Current-Max (ID) |
|
0.5 A
|
| Operating Temperature-Max |
|
150 °C
|
| Power Dissipation-Max (Abs) |
|
0.83 W
|
|
|
|
Compare 2N5639G with alternatives