27HC256-90/L vs M27V256-90B6 feature comparison

27HC256-90/L Microchip Technology Inc

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M27V256-90B6 STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC STMICROELECTRONICS
Part Package Code QFJ DIP
Package Description PLASTIC, LCC-32 DIP, DIP28,.6
Pin Count 32 28
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 90 ns 90 ns
JESD-30 Code R-PQCC-J32 R-PDIP-T28
Memory Density 262144 bit 262144 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form J BEND THROUGH-HOLE
Terminal Position QUAD DUAL
Base Number Matches 1 2
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Length 37.085 mm
Package Equivalence Code DIP28,.6
Programming Voltage 12.75 V
Seated Height-Max 5.08 mm
Standby Current-Max 0.00001 A
Supply Current-Max 0.01 mA
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare 27HC256-90/L with alternatives

Compare M27V256-90B6 with alternatives